NY Creates Announces Participation in 12-Inch Mask Industry Initiative to Advance High NA EUV Lithography Ecosystem
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NY Creates Announces Participation in 12-Inch Mask Industry Initiative to Advance High NA EUV Lithography Ecosystem
NY Creates today announced its inclusion in the 12-inch mask industry initiative, a newly formed collaboration designed to strengthen the high numerical aperture extreme ultraviolet (high NA EUV) lithography ecosystem.
TSMC and ASML created a joint project in Monterey, California, on September 7, 2026, to shift semiconductor manufacturing towards 12-inch photomasks for High NA EUV lithography systems. Both companies announced the technical initiative right before the opening of the SPIE BACUS Conference. The program sets a deadline to build an operational 12-inch mask pilot line [...]
TSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks — 6×12-inch photomask transition may take years despite unified effort
ASML, Intel, Samsung, and TSMC back development of 6×12-inch to build large processors using High-NA EUV lithography systems without stitching.
Like Samsung, TSMC has not rushed on the High-NA UV. The Taiwanese founder maximizes its current Low-NA processes and plans to introduce High-NA UV lithography into its volume production only from 2030 onwards...
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