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Education · United StatesStrategic Collaboration to Deliver Practical Chip Design Experience to Prepare the Next Generation of Engineering TalentSee the Story
Synopsys and GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
83% Center coverage: 6 sources
Artificial Intelligence · Australia/PRNewswire/ -- Today Synopsys (Nasdaq: SNPS) announced expanding Synopsys.ai™ Copilot generative AI (GenAI) capabilities for its industry-leading...See the Story
Synopsys Announces Expanding AI Capabilities for Its Leading EDA Solutions
100% Center coverage: 1 sources
Artificial Intelligence · WestfordWESTFORD, MA, USA, September 4, 2025 – Zuken Inc. (President: Katsube Jinya, hereinafter “Zuken”) has joined “JOINT3” consortium to develop next-generation semiconductor packaging. JOINT3 is a co-creation evaluation framework established by Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic inte…See the Story
