ASML to work with major chipmakers to use latest tools for larger chips
- On Tuesday, ASML announced that TSMC and Samsung Electronics committed to using its High NA EUV lithography machines, joining an industry initiative to adopt next-generation 12-inch photomask technology.
- Current 6-inch photomask formats restrict chip size, so moving to 12-inch masks supports the complex transistor architectures required for advanced AI applications. This upgrade addresses a key limitation in High NA EUV tools.
- ASML Chief Technology Officer Marco Pieters said system "productivity... will go up by 40%." These High NA EUV tools, costing around $400 million, enable printing finer, more intricate circuit patterns.
- Samsung plans to introduce High NA EUV into DRAM production by 2028, while TSMC targets 2030 for high-volume manufacturing. Hynix is evaluating participation in the 12-inch mask consortium for DRAM mass production.
- Barclays noted these announcements provide "more visibility on adoption," calling the news "a positive." ASML plans to add about 30% capacity for EUV production in 2027 to meet strong market demand.
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The Dutch manufacturer of ASML semiconductor equipment and Taiwanese TSMC have closed a strategic partnership to develop larger photomasks for extreme ultraviolet lithography (EUV). Exclusive material for subscribers. To have full access, access the material link and register.
TSMC backs ASML’s plan for bigger masks so its newest machines can print AI’s biggest chips
ASML’s most advanced lithography machines cannot print the largest chips the AI industry currently builds. The company now has a plan to change that, and it has brought TSMC in on it. The initiative was reported by Reuters on Tuesday and confirmed the same day in a joint announcement from the two companies. ASML wants to move […] This story continues at The Next Web
ASML to Partner with Major Chipmakers for Next-generation Tools for Larger Data Center Chips
Get latest articles and stories on Business at LatestLY. Dutch semiconductor equipment manufacturer ASML plans to collaborate with its major customers to deploy its most advanced tools for producing large data center chips designed by firms such as Nvidia, according to a news report by Reuters. Business News | ASML to Partner with Major Chipmakers for Next-generation Tools for Larger Data Center Chips.
TSMC, ASML partner on 12-inch EUV photomasks for advanced chips
Taipei, Sept. 8 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC) announced Tuesday that it will collaborate with Dutch semiconductor equipment maker ASML Holding N.V. to lead the semiconductor industry's transition to larger 12-inch extreme ultraviolet (EUV) lithography photomasks for advanced chip production.
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