Intel Foundry Achieves Milestone with One Million High-NA EUV Wafers

Intel Leaps 2-4 Years Ahead Of Samsung And TSMC On High-NA EUV Lithography After Producing Its 1 Millionth Test Wafer

The fates appear to have turned benevolent towards Intel, especially as its multi-year strategic pivots are now finally on the cusp of paying financial dividends, as evidenced by the chipmaker's rapidly expanding EMIB-T capacity as well as its hefty lead against Samsung and TSMC on high-NA EUV technology. UBS now believes Intel can easily meet MediaTek's growing TPU-related demand for EMIB-T advanced packaging, replete with the ability to packag…

Intel processes 1 million 300mm silicon wafers on high numerical aperture EUV equipment

Intel said it has processed 1 million 300mm silicon wafers using extreme ultraviolet (EUV) high numerical aperture (High-NA) lithography. The use of high numerical aperture EUV in silicon wafer manufacturing poses many challenges due to increased process complexity. Image source: Intel In 2024, Intel installed the ASML TWINSCAN EXE:5000 High-NA EUV system for 14A process […]

Intel Foundry Achieves Milestone with One Million High-NA EUV Wafers

Intel has officially processed one million 300 mm silicon wafers using High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography, as confirmed by the company yesterday. Using High-NA in silicon manufacturing presents many challenges due to the additional complexity it introduces, but for Intel, the opposite is true. Initially, Intel installed ASML's TWINSCAN EXE:5000 High-NA EUV systems in 2024 for research and testing of the 14A n…

Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined — company also trailblazing giant 6×12 photomasks to speed production and lower costs

Intel announced on Monday that it had processed more than one million 300-mm wafers using its High-NA EUV scanners, less than two and a half years after its first tool was assembled. For now, the company intends to use industry-standard 6-inch photomasks, which can expose 26×16.5 mm half-fields and therefore require field stitching for larger chips. However, Intel is also working on larger 6×12-inch photomasks that would enable High-NA EUV scann…