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We’ve aggregated 20 of electronics.org’s headlines and news stories over the past 3 months.

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Top electronics.org News

Artificial Intelligence · San Diego

How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process

How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process 1348234_juliaf… Jul 24, 2025 The use of inspection systems in production has increased as manufacturers use automated inspection technologies to capture defects in the production process. The benefits of utilizing the inspection systems include optimized production line operation, reduced labor and resource consumption, and an overall increase in yield and qualit…Read Article

San Diego · San Diego

Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation

Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation 1348234_juliaf… Jul 24, 2025 With the high power density and miniaturization of electronic products, printed circuit boards need to have more efficient thermal dissipation. In the thermal design of printed circuit board, more attention will be paid to the overall thermal dissipation of high-power products, usually ignoring its contribution to thermal dissipation i…Read Article

San Diego · San Diego

Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences Topic/Category: Factory of the Future OR Emerging Technologies

Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences Topic/Category: Factory of the Future OR Emerging Technologies 1348234_juliaf… Jul 24, 2025 It has been demonstrated it is possible to combine design, process, and metrology information to create machine learning models that accurately predict the behavior of individual products in the manufacturing line. In this work, we extend the application of these single pr…Read Article

Reliability Validation of Direct-Write Printed RF Devices

Reliability Validation of Direct-Write Printed RF Devices 1348234_juliaf… Jul 24, 2025 Additive manufacturing (AM) methods to fabricate and repair printed hybrid electronic (PHE) components and interconnect systems create compelling opportunities in 3D curvilinear architectures for printing RF components and interconnections. However, significant technical challenges remain that must be overcome to develop practical techniques for assuring cons…San Diego · San Diego Read Article

The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Assembly

The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Assembly 1348234_juliaf… Jul 24, 2025 Lower temperature soldering has been regarded as one of the most effective ways to reduce warpage risk. Use of lower-temperature solders, including a BiSnAgCu eutectic and two In-containing, Bi-free solders - ILT, and ILT-2 has been attempted to reflow the 40 mm x 40 mm plastic ball grid array (PBGA928). BiSnAg,…San Diego · San Diego Read Article

Liquid Metal Patterning for Electronic Circuits and Thermal Management

Liquid Metal Patterning for Electronic Circuits and Thermal Management 1348234_juliaf… Jul 24, 2025 Gallium-based liquid metals have remarkable properties: melting points below room temperature, wide conductivity, water-like viscosity, low toxicity, and effectively zero vapor pressure (they do not evaporate). They also have the largest interfacial tension of any liquid at room temperature. Normally, small volumes of high-tension liquids form sp…San Diego · San Diego Read Article

Tracking Voiding and Solder Coverage of SMT Solder Joints by Automated X-Ray Inspection - a Revealing Round Robin Study

Tracking Voiding and Solder Coverage of SMT Solder Joints by Automated X-Ray Inspection - a Revealing Round Robin Study 1348234_juliaf… Jul 24, 2025 Voiding and solder coverage in SMT solder joints remain a matter of (sometimes emotional) debate in automotive electronics. Meanwhile voiding/solder coverage requirements have been introduced into IPC J-STD-001HA/IPC-A-610HA. But beside the question of reasonable requirements, the topic of void qua…Germany · Germany Read Article

Research on High-speed Material Insertion Loss in Server Platform

Research on High-speed Material Insertion Loss in Server Platform 1348234_juliaf… Jul 24, 2025 At present, with the rapid change of the server market, Eagle Stream platform chipset, which changes the traditional practice of Whiley platform material selection and stack mode compared with the previous and provides a new reference perspective for everyone.The Eagle Stream platform differs from the Whiley platform in the selection of materials. Fir…Research · San Diego Read Article

Achieving a Successful ENEPIG Finished PCB under Revision A of IPC-4556

Achieving a Successful ENEPIG Finished PCB under Revision A of IPC-4556 1348234_juliaf… Jul 24, 2025 The 4-14F IPC Standards Committee are close to finalizing (at the time of writing) a revision to the IPC 4556 specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) finished Printed Circuit Boards (PCB). Revision A brings a more comprehensive evaluation of metal layer thickness measurements, compositions, and introduc…San Diego · San Diego Read Article

Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for Passive Thermal Management Applications

Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for Passive Thermal Management Applications 1348234_juliaf… Jul 24, 2025 Continued microelectronic miniaturization has resulted in higher power density, increasing the need for high performance thermal management. One solution for board-level thermal management is to encapsulate a high thermal conductivity material, such as pyrolytic graphite (~1700 W…San Diego · San Diego Read Article

Texas/Dallas Area EMS Leadership Roundtable: Bot or Not? AI, Automation, and Assembling the Workforce of the Future

Open the article to view the coverage from electronics.orgArtificial Intelligence · Dallas Read Article

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Top electronics.org News

How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process

Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation

Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences Topic/Category: Factory of the Future OR Emerging Technologies

Reliability Validation of Direct-Write Printed RF Devices

The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Assembly

Liquid Metal Patterning for Electronic Circuits and Thermal Management

Tracking Voiding and Solder Coverage of SMT Solder Joints by Automated X-Ray Inspection - a Revealing Round Robin Study

Research on High-speed Material Insertion Loss in Server Platform

Achieving a Successful ENEPIG Finished PCB under Revision A of IPC-4556

Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for Passive Thermal Management Applications

Texas/Dallas Area EMS Leadership Roundtable: Bot or Not? AI, Automation, and Assembling the Workforce of the Future

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Media Bias Ratings

Factuality

Ownership

Reliability Validation of Direct-Write Printed RF Devices

The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Assembly

Liquid Metal Patterning for Electronic Circuits and Thermal Management

Tracking Voiding and Solder Coverage of SMT Solder Joints by Automated X-Ray Inspection - a Revealing Round Robin Study

Research on High-speed Material Insertion Loss in Server Platform

Achieving a Successful ENEPIG Finished PCB under Revision A of IPC-4556

Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for Passive Thermal Management Applications

Texas/Dallas Area EMS Leadership Roundtable: Bot or Not? AI, Automation, and Assembling the Workforce of the Future