Xiaomi takes another shot at Qualcomm and MediaTek with its 3nm flagship Xring O3 chip
The chip adds a 10-core CPU, 200 TOPS AI hardware and LPDDR6 support as Xiaomi seeks more control over its smartphone roadmap.
- On Monday, August 24, 2026, Xiaomi unveiled the XRING O3, a flagship 3nm system-on-chip featuring a 10-core CPU and native LPDDR6 memory support for its premium devices.
- Manufactured by TSMC, the platform signals Xiaomi's push for semiconductor self-reliance, aiming to reduce dependence on Qualcomm and MediaTek while enabling tighter hardware-software integration.
- Performance data shows the chip achieves a 5.22 million AnTuTu score and 200 TOPS of tensor performance, delivering a 45% increase in edge AI capabilities for Xiaomi's MiMo large language models.
- Xiaomi confirmed the processor will debut in the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max this September, though analysts expect limited initial production volumes.
- Bloomberg Intelligence analysts noted Xiaomi's 3nm strategy emphasizes architectural upgrades while rivals transition to 2nm, though the company remains dependent on established partners for most smartphone lineups.
15 Articles
15 Articles
Xiaomi takes another shot at Qualcomm and MediaTek with its 3nm flagship Xring O3 chip
Built on a 3-nanometer process, the chip is designed for flagship devices, with a focus on AI workloads, graphics performance, and camera processing. The manufacturing technology puts Xiaomi closer to Apple's latest A19 Pro chips and ahead of Huawei's current in-house smartphone processors.Read Entire Article
Xiaomi recently introduced its new Xring O3 chip, a significant leap forward in high-performance smartphone processors. This chip aims to enhance the capabilities of premium phones and compete with leading companies in the field. A first look at Xiaomi's Xring O3 chip reveals that Xiaomi has introduced a new processor for high-end smartphones, reflecting its growing efforts to develop the technology that powers its smartphones. The Xring O3 is X…
Xiaomi targets Apple and Qualcomm with custom XRING O3 chip: Check full specs
Xiaomi has officially taken the wraps off its flagship XRING O3 processor–a custom 3nm system-on-chip that shatters benchmark records with a 5.22-million AnTuTu score, introduces the mobile industry's first native LPDDR6 memory support, and delivers 200 TOPS of localized AI computing power.
(Beijing=Yonhap News) Correspondent Jung Sung-jo = China's largest DRAM... in the latest processor 'XRING (Chinese name Xuanjie) O3' announced by China's Xiaomi
Xiaomi unveils Xring O3 as it expands in-house chip push · TechNode
Xiaomi unveiled its second in-house smartphone processor, the Xring O3, as it seeks greater control over key components and reduced reliance on external suppliers. TSMC is expected to manufacture the chip using a 3-nanometer process. Xiaomi said devices powered by its first Xring O1 processor had surpassed 1 million cumulative shipments. The company has also contracted TSMC to produce the Xring O100 AI chip and Xring D100 autonomous-driving chip.
Xiaomi's Xring O3 impresses in early benchmark tests, scores 15,086 in Geekbench multi-core
Xiaomi just officially unveiled its latest flagship mobile chipset, the Xring O3, and the early independent tests are already making headlines. Building on last year’s solid Xring O1, this new processor is getting a lot of attention for packing strong performance with better efficiency. According to tests from Chinese outlet Xiaobai’s Tech Reviews (run on what looks like a reference design), the Xring O3 scores 3,854 in Geekbench single-core. Th…
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