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What Is 3D-IC Technology? Fundamentals, Architecture, And Design Concepts

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher power density, routing congestion, and reduced yield. Three-dimensional integrated circuits (3D-IC) technology represents a breakthrough approach by stacking multiple dies vertically. This design reduces communication paths, increases bandwidth, and si…
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Semiconductor Engineering broke the news in on Tuesday, November 25, 2025.
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