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China's RISC-V charge expedites: DAMO Academy, BOSC go deep on server-class and 16-core CPUs

China is accelerating its deployment of RISC-V architecture as US-China tech decoupling intensifies, aiming to build a fully autonomous semiconductor supply chain. At the 5th RISC-V Summit China in Shanghai, Alibaba's DAMO Academy introduced new advances in its high-performance RISC-V platform under the XuanTie brand. Concurrently, the Beijing Institute of Open Source Chip (BOSC) confirmed system-level validation of its third-generation 16-core …Technology · China See the Story

Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces

In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is expected to continue, with expansion into areas such as central processing units (CPUs), artificial intelligence (AI) systems, and automotive products. Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-perf…San Jose, California · San Jose Read Article

GPU Acceleration Of Rigorous Lithography Simulations

Producing modern semiconductor devices is an immensely challenging process. Successful execution entails advanced process nodes, novel device architectures, new materials, and many fabrication steps. One especially challenging area is lithography, in which light is sent through a photomask, passes through a projection system of lenses and mirrors, and strikes the substrate to create the device structures. In the early days of chip production, th…San Jose, California · San Jose Read Article

AI, Product Lifecycle Management, Market Dynamics: Q&A With Jay Vleeschhouwer Of Griffin Securities

In the world of EDA, Jay Vleeschhouwer, managing director of software research at Griffin Securities, needs no introduction. His presentation on the State of EDA is standing room only at the yearly Design Automation Conference (DAC). He recently agreed to a discussion with me where we talked about AI and EDA, an interesting development with product lifecycle management and global dynamics affecting EDA. A condensed version of our talk follows. B…Artificial Intelligence · Phoenix Read Article

The Rise Of Panel-Level Packaging

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum reticle size in the next few years. These assemblies are best developed using fan-out panel-level packaging, replacing today’s wafer carrier with a panel. Fan-out packaging enables substantially lower cost than silicon interposers, while accommodating…Artificial Intelligence · Dallas Read Article

Semiconductor Virtual Fabrication And Its Applications

Semiverse Solutions, particularly SEMulator3D, can enhance semiconductor engineering in several ways. SEMulator3D is a software platform for semiconductor process modeling and virtual fabrication.1 Prototyping and visualization: Virtual fabrication aids in understanding and visualizing complex semiconductor structures in three dimensions, facilitating better design and prototyping. Unit process development: The platform accelerates the optimiza…United States · United States Read Article

40th EMLC Honors Three Decades Of Vision From Dr. Uwe Behringer

The European Mask Lithography Conference (EMLC), an annual event that brings together researchers from around the world to present the latest findings on photomask and lithography technology, returned to Dresden from June 16 to June 18, 2025, and took place for the 40th time – marking a memorable anniversary combined with a premiere. For over 30 years, Dr. Uwe Behringer shaped the conference as Conference Chair. Starting this year, Ines Stolberg…Dresden, Sachsen · Dresden Read Article

News from Semiconductor Engineering

News from Semiconductor Engineering