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Transformation Of 2D-ICs Into 3D-ICs Using Shuttle Chips From Multi-Project Wafers (Tohoku University)
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Transformation Of 2D-ICs Into 3D-ICs Using Shuttle Chips From Multi-Project Wafers (Tohoku University)
A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University. Abstract “Three-dimensional integrated circuit (3D-IC) technology, often referred to as through-silicon via (TSV) formation technology, has been steadily maturing and is increasingly used in advanced semiconductor devices such as 3D complementary metal-oxide-se…
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