Thermal Slip Length at a L/S Interface: Power Law Relations From Spatial and Frequency Attributes of the Contact Layer (Caltech)

Thermal Slip Length at a L/S Interface: Power Law Relations From Spatial and Frequency Attributes of the Contact Layer (Caltech)

A new technical paper titled “Thermal Slip Length at a Liquid/Solid Interface: Power Law Relations From Spatial and Frequency Attributes of the Contact Layer” was published by researchers at California Institute of Technology, , T. J. Watson Sr. Laboratories of Applied Physics. Abstract “Specialty integrated chips for power intensive tasks like artificial intelligence generate so much heat that data centers are switching to liquid cooling to pre…