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The Rise Of Panel-Level Packaging
Summary by Semiconductor Engineering
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The Rise Of Panel-Level Packaging
An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum reticle size in the next few years. These assemblies are best developed using fan-out panel-level packaging, replacing today’s wafer carrier with a panel. Fan-out packaging enables substantially lower cost than silicon interposers, while accommodating…
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