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The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Assembly
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The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Assembly
The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Assembly 1348234_juliaf… Jul 24, 2025 Lower temperature soldering has been regarded as one of the most effective ways to reduce warpage risk. Use of lower-temperature solders, including a BiSnAgCu eutectic and two In-containing, Bi-free solders - ILT, and ILT-2 has been attempted to reflow the 40 mm x 40 mm plastic ball grid array (PBGA928). BiSnAg,…
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