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Teledyne HiRel Semiconductors Announces High-Density 16 GByte DDR4 Module - Semiconductor Digest
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Teledyne HiRel Semiconductors Announces High-Density 16 GByte DDR4 Module - Semiconductor Digest
Teledyne HiRel Semiconductors today announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) and rated for operation from –40°C to +105°C. The TDD416Y12NEPBM01, is a compact, solder-down DDR4-3200 memory solution that delivers high bandwidth in a dramatically reduced footprint – smaller than a postage stamp. Packaged in a 216-ball BGA measuring just 22mm x 22mm, it is enginee…
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