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Study Of Multi-Die And Multi-Technology Floorplanning (Texas A&M, Duke)

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A new technical paper titled “PPAC Driven Multi-die and Multi-technology Floorplanning” was published by Texas A&M University and Duke University. Abstract“In heterogeneous integration, where different dies may utilize distinct technologies, floorplanning across multiple dies inherently requires simultaneous technology selection. This work presents the first systematic study of multi-die and multi-technology floorplanning. Unlike many convention…
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Semiconductor Engineering broke the news in on Saturday, April 5, 2025.
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