Samsung Electro-Mechanics Showcases Next-Generation AI Chip Substrates
4 Articles
4 Articles
Samsung Electro-Mechanics is unveiling next-generation semiconductor substrate technologies, including 2.5D and 2.1D package substrates and glass substrates used in AI accelerators and servers. Samsung Electro-Mechanics is participating in the ‘KPCA Show 2026 (International Semiconductor Substrate & Advanced Packaging Industry Exhibition)’ held at Incheon Songdo Convention Center starting on the 9th. The exhibition runs until the 11th. Semicondu…
[Digital Daily Reporter Ko Seong-hyeon] Samsung Electro-Mechanics and LG Innotek are showcasing next-generation package substrate technologies targeting the high-performance semiconductor market, including AI accelerators and servers, in one place. They plan to lead the way with next-generation technological competitiveness to respond to the AI era, including large-area, high-multilayer FC-BGA, 2.5D and 2.1D package substrates, and glass substra…
Samsung Electro-Mechanics participated in the 'KPCA Show 2026' (International Semiconductor Substrate and Advanced Packaging Industry Exhibition), held at Incheon Songdo Convention Center from the 9th to the 11th, and [discussed] next-generation semiconductor package substrates.
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