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OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers

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Semiconductor DigestSemiconductor Digest

OKI Develops Tiling CFB Technology for Heterogeneous Integration of Optical Semiconductors onto 300mm Silicon Wafers - Semiconductor Digest

Contributing to the advancement of photonics-electronics convergence technology and working with partners for early commercialization.

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The AI JournalThe AI Journal

OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers

Open the article to view the coverage from The AI Journal

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The AI Journal broke the news in on Thursday, August 14, 2025.
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