This 3D-Printed Heatsink Can Cut Cooling Size and Weight by over 50%

This 3D-printed heatsink can cut cooling size and weight by over 50%

Johns Hopkins APL researchers are developing a 3D-printed phase-change heatsink that could cut thermal-management size and weight by over 50%.

New 3D-Printed Heatsink Could Cut Size and Weight by Half

Engineers at the Johns Hopkins Applied Physics Laboratory (APL) have developed a compact, 3D-printed heatsink that could protect electronics in systems where space and weight are severely limited. The technology, called SPEAR, combines phase-change materials with additive manufacturing, also known as 3D printing. It is designed to absorb large amounts of heat produced over short […]