Multi-Die Assemblies Complicate Parasitic Extraction

Multi-Die Assemblies Complicate Parasitic Extraction

The shift from planar designs to multi-die assemblies with complex interconnects is transforming what had become almost an afterthought in the design process into a first-order challenge. Parasitics include things like inductance, capacitance, and resistance, which have become more problematic at advanced nodes due to increasing logic density, thinner interconnects and insulators, and a spike in the amount of data that needs to be processed, mov…