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Maximizing Signal Integrity: Fine-Tuning Via Impedance In HDFO Architectures
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Maximizing Signal Integrity: Fine-Tuning Via Impedance In HDFO Architectures
The most different aspect between a normal lamination structure and High-Density Fan-out (HDFO) is the routing scale. That aspect is also the challenge and focus of this study. At an HDFO scale, most of the electrical properties cannot be measured by instruments. Therefore, this study uses the indirect method to determine the impedance information of the via and match the impedance. Since the via structure is very complex and varies, this study …
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