Imec and EV Group Demo Fine-Pitch Wafer-to-Wafer Hybrid Bonding

Imec and EV Group demo fine-pitch wafer-to-wafer hybrid bonding

Imec and EV Group (EVG) have developed wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad pitch demonstrated on a test vehicle with routable interconnects. In addition, a record high ... The post Imec and EV Group demo fine-pitch wafer-to-wafer hybrid bonding appeared first on Electronics Weekly.

Imec and EV Group Demonstrate Wafer-to-Wafer Hybrid Bonding with 200nm Interconnect Pitch and Record High Overlay Accuracy

Imec and EV Group (EVG) are focusing on advancing the overlay performance required for advanced logic-to-logic and memory-to-logic tier stacking.