US Edition
Published • loading... • Updated
Grouping Complex Wafer Defect Patterns Into Meaningful Clusters (Oregon State Univ., Micron)
Summary by Semiconductor Engineering
This story is only covered by news sources that have yet to be evaluated by the independent media monitoring agencies we use to assess the quality and reliability of news outlets on our platform. Learn more here.1 Articles
1 Articles
Grouping Complex Wafer Defect Patterns Into Meaningful Clusters (Oregon State Univ., Micron)
A new technical paper titled “DECOR: Deep Embedding Clustering with Orientation Robustness” was published by researchers at Oregon State University and Micron Technology. Abstract “In semiconductor manufacturing, early detection of wafer defects is critical for product yield optimization. However, raw wafer data from wafer quality tests are often complex, unlabeled, imbalanced and can contain multiple defects on a single wafer, making it crucial…
Coverage Details
Total News Sources1
Leaning Left0Leaning Right0Center0Last UpdatedBias DistributionNo sources with tracked biases.
Bias Distribution
- There is no tracked Bias information for the sources covering this story.
Factuality
To view factuality data please Upgrade to Premium
