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Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces
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Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces
In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is expected to continue, with expansion into areas such as central processing units (CPUs), artificial intelligence (AI) systems, and automotive products. Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-perf…
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