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Development And Deployment Of 2.5D Multi-Foundry Chiplet Solution Scaling Beyond Multi-Reticle Approaches (Intel) - Data Intelligence
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Development And Deployment Of 2.5D Multi-Foundry Chiplet Solution Scaling Beyond Multi-Reticle Approaches (Intel) - Data Intelligence
A new technical paper titled “System-Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution” was published by researchers at Intel Corporation. Abstract“The proliferation of chiplet-based designs, driven by the escalating computational demands of AI, presents unique validation challenges when integrating heterogenous chiplets. This paper investigates the complexities of realizing large-scale chiplet syst…
Development and Deployment of 2.5D Multi-Foundry Chiplet Solution Scaling Beyond Multi-Reticle Approaches (Intel)
A new technical paper titled “System-Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution” was published by researchers at Intel Corporation. Abstract “The proliferation of chiplet-based designs, driven by the escalating computational demands of AI, presents unique validation challenges when integrating heterogenous chiplets. This paper investigates the complexities of realizing large-scale chiplet sys…
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