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Cooling Chips Still A Top Challenge
Summary by Semiconductor Engineering
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Cooling Chips Still A Top Challenge
Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their functionality and their longevity. And while much of the focus has been on improving power efficiency, which reduces the rate of power growth, that alone is insufficient. Also needed are a v…
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