Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging ...
7 Articles
7 Articles
Applied Materials is expanding the scope of its joint development of advanced packaging technologies for artificial intelligence (AI) semiconductors with semiconductor packaging equipment manufacturer Besi (BE Semiconductor Industries). The plan is to broaden the scope of cooperation beyond existing hybrid bonding to include next-generation interconnect technologies that connect chips to chips and chips to packages, as well as panel-level integr…
Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging ...
Besi joins Applied's EPIC Center as an Innovation Partner, extending a collaboration that began in 2020 with the companies' joint Hybrid Bonding Center of Excellence in SingaporeExpanded collaboration targets next-generation 3D IC scaling, logic and memory integration, and photonics applications…
[Digital Daily Reporter Bae Tae-yong] Applied Materials, a global semiconductor materials engineering solutions company, is significantly expanding its strategic partnership with Besi, a Dutch advanced packaging equipment manufacturer. The two companies will jointly embark on the development of next-generation interconnects, panel-level integration, and Optical Coupling (CPO) technology to accelerate the scaling of artificial intelligence (AI) s…
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Cryptocurrency News | Cryptocurrency Prices | Market CapApplied Materials and Besi expand partnership to push AI chip packaging forward
Applied Materials and Besi expand their hybrid bonding partnership as Kinex lands an SK hynix HBM order and AI chip packaging demand grows.
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