AI restructures Siemens EDA tools

Blog Review: June 25

Siemens’ John McMillan provides a detailed overview of 3D-IC technology and heterogeneous integration, from the market trends driving its adoption to the design, verification, and manufacturing challenges involved. Synopsys’ Gunnar Braun and Stewart Williams check out how cloud-based development practices and virtual prototypes can enable earlier and more efficient testing and validation for software-defined vehicles. Cadence’s Moshiko Emmer war…

AI restructures Siemens EDA tools

Siemens EDA is restructuring the structure of its EDA tools to adopt a new architecture for artificial intelligence (AI) and machine learning (ML). The Questa, Calibre and Solido EDA tools have relied on individual complex databases to hold information about custom chips, chiplets and 3D-IC substrates and even chips on a printed circuit board designs. […] The post AI restructures Siemens EDA tools appeared first on eeNews Europe.

Siemens unveils AI-powered EDA tools at 2025 Design Automation Conference

At the 2025 Design Automation Conference, Siemens Digital Industries Software introduced its AI-enhanced toolset for the EDA design flow. The company is demonstrating how AI can support productivity, shorten development timelines, and assist customers in exploring new design opportunities. Siemens is showcasing a new EDA AI system designed for semiconductor and PCB design environments. The system provides generative and agent-based AI features, …

Siemens Powers Semiconductor and PCB Design with AI - Mpelembe Network

The provided text announces that Siemens Digital Industries Software has significantly enhanced its Electronic Design Automation (EDA) portfolio by integrating generative and agentic Artificial Intelligence (AI) capabilities. This advancement aims to boost productivity, accelerate innovation, and reduce time-to-market for semiconductor and PCB designs. Siemens’ new EDA AI system offers secure, customisable workflows, leveraging technologies from…