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Neubiberg · NeubibergBy Marion Webber Infineon Technologies AG has launched the CoolSiC MOSFETs 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency and power density. They The post Infineon’s CoolSiC MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications appeared first on IoT Now News – How to run an IoT enabled business. Read more here:: www.m2mnow.biz/f…See the Story
Infineon’s CoolSiC MOSFETs 1200 V G2 in a Q-DPAK Package Enable Higher Power Density for Industrial Applications
Neubiberg · NeubibergInfineon Technologies AG has launched the third generation of the XENSIV 3D magnetic Hall-effect sensor family, comprising three product series: TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8. Developed in accordance with ISO26262, the sensor family provides integrated diagnostic functions to support functional safety applications up to ASIL-B. Due to their high flexibility, the devices are ideal for a wide range of industrial, consumer, and au…Read Article
3D Hall-effect sensors support 3.3 V and 5 V supply voltages for ASIL-B applications
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