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Xintec readies 12-inch IVR backside copper for TSMC's next-gen AI chips
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Xintec readies 12-inch IVR backside copper for TSMC's next-gen AI chips
TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging for AI chips, while market speculation points to a broader outsourcing role for the company in CoWoS back-end assembly.
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