Xiaomi Unveils New Chip, Taps TSMC for Foldable Push
5 Articles
5 Articles
(Beijing=Yonhap News) Correspondent Jung Sung-jo = China's largest DRAM... in the latest processor 'XRING (Chinese name Xuanjie) O3' announced by China's Xiaomi
Xiaomi unveils new chip, taps TSMC for foldable push
Xiaomi reportedly showcased its Xring O3 smartphone processor, the latest in the company’s push to reduce its reliance on external chip suppliers and strengthen its position in the premium and foldable smartphone markets. The chip was revealed at Xiaomi’s Xring Chip Technology Communication Conference. According to EE Times China, cited by trade publication TrendForce, the 3nm processor has more than 24 billion transistors. This is a 26% increas…
Xiaomi XRING O3 mobile chip supports CXMT LPDDR6 memory
Xiaomi has announced its new-generation mobile chip – XRING O3, which reportedly supports the CXMT LPDDR6 memory processor. With that, the new chip has become the world’s first flagship smartphone SoC to support the latest advanced memory. Some sources revealed that CXMT is supplying LPDDR6 memory to Xiaomi XRING O3 chip. This move marks the first-ever use of a Chinese LPDDR6 memory in a top-tier smartphone chipset. CXMT has already completed R&…
Xiaomi has just taken a new step in its silicon strategy with the Xring O3, its second large home SoC for smartphones. Always manufactured by TSMC in 3 nm, it must allow the Chinese manufacturer to better control the integration between hardware, HyperOS and IA, without signing the immediate end of the Snapdragon and Dimensity [...] Article Xiaomi Xring O3: The new SoC 3 nm manufactured by TSMC is already targeting future foldable smartphones ha…
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