Xanadu Partners with DISCO to Develop Advanced Wafer Processing

Xanadu partners with DISCO to develop advanced wafer processing

This partnership focuses on enhancing wafer dicing processes, specialized wafer preparation for heterogeneous integration and assembly, as well as achieving ultra-smooth surfaces through polishing optimization.

Xanadu partners with DISCO for advanced photonic chip processing

Xanadu partners with DISCO to enhance wafer processing, aiming to boost production of ultra-low loss photonic chips for quantum computing.

Xanadu and DISCO Collaborate on Advanced Wafer Processing for Photonic Quantum Computing - Quantum Computing Report

Xanadu, a Canadian quantum computing company, and DISCO Corporation, a Japan-based precision machine and processing tool manufacturer, have announced a collaboration on advanced wafer processing techniques for ultra-low loss photonic integrated chips. The partnership focuses on enhancing wafer dicing, specialized wafer preparation for heterogeneous integration and assembly, and achieving ultra-smooth surfaces through polishing optimization. Thes…