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UMC accelerates advanced packaging and silicon photonics development as AI drives demand
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UMC accelerates advanced packaging and silicon photonics development as AI drives demand
As artificial intelligence (AI) applications expand globally, United Microelectronics Corporation (UMC) is intensifying its efforts in advanced packaging and silicon photonics (SiPh) technologies. UMC co-president Jason Wang highlighted that although these segments currently generate modest revenues, a surge in project activity is anticipated to drive "significant growth" beginning in 2027, marking a strategic focus on emerging markets tied to A…
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