TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises

TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises

As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers has emerged. To address the strong demand for advanced packaging capacity from AI GPU and ASIC vendors, and as IC design houses increasingly introduce second suppliers to enhance supply chain resilience, TSMC is expected to begin expanding the release of Chip-on-Wafer …