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TSMC shows smaller, faster chips without a pricey new tool from ASML
The company said A13 will target AI chips and N2U will cut costs while it squeezes more performance from existing EUV tools.
- On Wednesday, Taiwan Semiconductor Manufacturing Co unveiled A13 and N2U manufacturing technologies, announcing plans to delay adoption of ASML's "high NA" machines through 2029 to manage costs.
- TSMC expects to squeeze gains from existing extreme-ultraviolet lithography machines rather than purchase new tools that cost about $400 million each, reflecting cost discipline after strong Q1 profitability.
- By 2028, the company plans to utilize advanced stitching technology combining 10 large computing chips with 20 memory stacks, targeting performance gains for artificial intelligence processors like Nvidia's Vera Rubin.
- ASML shares fell as much as 4% following the announcement, while TechInsights' Dan Hutcheson noted "Moore's law is morphing from a monolithic, single die in a package to multi-die in a package."
- Stitching chips introduces physical challenges like bending or cracking. Ian Cutress of consultancy More Than Moore cautioned that TSMC "aren't addressing directly how they are solving those challenges.
13 Articles
13 Articles
TSMC shows smaller, faster chips without a pricey new tool from ASML
Taiwan Semiconductor Manufacturing Co on Wednesday showed its newest generation of chip manufacturing technology, saying it expects to be able to create smaller, faster chips without requiring expensive new machines from ASML.
As part of the North America Technology Symposium 2026 in Santa Clara, TSMC revealed its roadmap, which leads almost until the end of the decade (the delay was at 2027). The "step nodes" added to the itinerary are the 1.2 nm and 1.3 nm class processes, called A12 and A13, as well as the N2U, an extension of the N2...
TSMC Says Low-NA EUV Will Carry It Further, Delaying High-NA Adoption
Yesterday, TSMC unveiled its latest A13 node preview at the North America Technology Symposium, highlighting the company's ongoing developments. However, the most significant news isn't about a new node but the technology behind it. TSMC announced it would rely on older ASML Low-NA EUV tools instead of the more expensive High-NA EUV scanners. With the High-NA EUV scanner priced at about €350 million ($410 million), the capital expenditure requir…
Why did TSMC avoid high-NA EUV until 2029?
TSMC says it will hold off on using ASML’s most advanced high NA EUV machines —systems that reportedly cost €350M+ apiece —for production through 2029 , primarily to save money . The decision is notable because next generation EUV tools are expected to tighten the link between leading edge process…
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