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TSMC integrates CoWoS packaging with Coupe photonics for AI performance boost

Summary by technewstube.com
Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining its CoWoS packaging platform with a new silicon photonics engine dubbed "Coupe" to advance high-density computing and AI system performance.
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technewstube.comtechnewstube.com

TSMC integrates CoWoS packaging with Coupe photonics for AI performance boost

Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining its CoWoS packaging platform with a new silicon photonics engine dubbed "Coupe" to advance high-density computing and AI system performance.

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technewstube.com broke the news in on Wednesday, August 13, 2025.
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