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TSMC to Open Munich Design Centre in Q3 to Support Advanced Chip Design for Europe · TechNode
- TSMC revealed plans to establish a chip design facility in Munich, Germany, scheduled to begin operations by the third quarter of 2025, aiming to support its customers across Europe.
- This move follows the EU's push for semiconductor self-reliance and TSMC's ongoing investment in European manufacturing, including a plant in Dresden.
- The Munich center will focus on high-density, high-performance, and energy-efficient chips for automotive, industrial, AI, and IoT sectors, expanding TSMC's global design network.
- Paul de Bot, TSMC's Europe president, stated that the center aims to assist clients across Europe in developing advanced chips that deliver exceptional performance, high density, and energy efficiency.
- This initiative is a strategic step to strengthen Europe’s technological autonomy amid global trade tensions and rising AI-driven chip demand.
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TSMC to open Munich Design Centre in Q3 to support advanced chip design for Europe · TechNode
At TSMC’s 2025 Europe Technology Symposium, Paul de Bot, General Manager of the European Semiconductor Manufacturing Company (ESMC), announced that TSMC’s Munich Design Centre will be launched in the third quarter. The Munich Design Centre is intended to support chip design customers served by the ESMC fab. “This is to help European customers design high-density, high-performance, and energy-efficient chips, with a continued focus on automotive,…
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