TSMC, Amkor Sign 10-Year Deal to Boost Advanced Chip Packaging in US
The pact will expand advanced packaging and testing in the United States as demand rises for AI and high-performance computing chips.
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TSMC, Amkor sign 10-year deal to boost advanced chip packaging in US
Taiwan Semiconductor Manufacturing Co (TSMC) and US-based chip packaging and testing provider Amkor Technology have signed a 10-year agreement aimed at expanding advanced semiconductor packaging and testing capabilities in the United States, according to a news report by Focus Taiwan.
TSMC, Amkor sign 10-year deal to boost advanced chip packaging in US - The Tribune
Taiwan Semiconductor Manufacturing Co (TSMC) and US-based chip packaging and testing provider Amkor Technology have signed a 10-year agreement aimed at expanding advanced semiconductor packaging and testing capabilities in the United States, according to a news report by Focus Taiwan.
TSMC, Amkor sign 10-year deal to boost advanced chip packaging in U.S.
Taipei, June 18 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC) and U.S.-based chip packaging and testing provider Amkor Technology have signed a 10-year agreement aimed at expanding advanced semiconductor packaging and testing capabilities in the United States.
TSMC, Amkor strike agreement
By InBusiness PHX Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem. The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By worki…
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