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The data center cooling state of play (2025) — Liquid cooling is on the rise, thermal density demands skyrocket in AI data centers, and TSMC leads with direct-to-silicon solutions
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World NEWS LiveThe data center cooling state of play (2025) — Liquid cooling is on the rise, thermal density demands skyrocket in AI data centers, and TSMC leads with direct-to-silicon solutions
The rise of AI and hyperscale computing is driving a global shift from air-based to liquid and embedded cooling as various companies are developing silicon-integrated systems capable of handling multi-kilowatt system-in-packages that can be commercialized by 2027.
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