SK Hynix Unveils AI Memory at TSMC Event… Partner Award for 2 Consecutive Years
4 Articles
4 Articles
SK Hynix has been selected as "Partner of the Year" for the second consecutive year in recognition of its collaborative achievements with TSMC, the world's largest foundry (semiconductor contract manufacturer), in verifying HBM5, the 8th-generation High Bandwidth Memory (HBM). The company also unveiled next-generation AI memory products, including HBM4 and SOCAMM2, which are integrated into NVIDIA's next-generation AI platform, Vera Rubin. HBM5 …
(Seoul = Yonhap News) Reporter Kang Tae-woo = SK Hynix [000660] [showed] high bandwidth memory at a technology event hosted by TSMC, the world's largest foundry (semiconductor contract manufacturing) company...
Nvidia’s next-generation superchip ‘Vera Rubin’ unveiled by SK hynix at the ‘TSMC Open Innovation Platform (OIP) Conference’ held in Santa Clara, California. (Photo courtesy of SK hynix) SK hynix said on Sept. 28 that it took part in the “TSMC Open Innovation Platform (OIP) Conference,” held in Santa Clara, California, on Sept. 23 local time, where it introduced next-generation artificial intelligence memory products and its development strategy…
SK Hynix has been selected as ‘Partner of the Year’ for the second consecutive year in recognition of its achievement in jointly verifying HBM5, the next-generation High Bandwidth Memory (HBM), and Taiwan’s TSMC’s advanced packaging technology. NVIDIA’s next-generation superchip ‘Vera Rubin,’ unveiled by SK Hynix at the ‘TSMC Open Innovation Platform (OIP) Conference’ held in Santa Clara, California. (Photo = SK Hynix) SK Hynix...
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