Hot Chips 2026: SK Hynix Pushes Hybrid Bonding HBM5 as AI Memory Hits 775-Micron Ceiling — Firm Extends MR-MUF Through Nvidia Rubin

Hot Chips 2026: SK hynix pushes hybrid bonding HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin

This Tom's Hardware Premium article is free to read with a Tom's Hardware account; no payment necessary. We're offering free access from August 23 to 26 so you can read all of our reporting from Hot Chips.SK hynix doesn't expect hybrid bonding to be ready for HBM4E, Jaesik Lee, VP of package engineering at SK hynix America, said during a presentation at Hot Chips 2026 on August 23, pushing the industry's most anticipated memory packaging transit…

SK hynix pushes hybrid bonding HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin

SK hynix doesn't expect hybrid bonding to be ready for HBM4E, Jaesik Lee, VP of package engineering at SK hynix America, said during a presentation at Hot Chips 2026 on August 23, pushing the industry's most anticipated memory packaging transition out to HBM5 at the earliest. The problem, as he describes it, is that HBM cubes are capped at a total thickness of 775 microns - the standard thickness of a 300mm logic wafer - so every additional DRAM…

Samsung Confirms HBM4E Memory Running at 16 Gbps Per Pin

At the Hot Chips 2026 conference's Advance Program, Samsung's Sangwook Han confirmed that the company is preparing to ship HBM4E memory with speeds of 16 Gbps per pin. This is a significant confidence boost for Samsung's Semiconductor division, which has been shipping HBM4E with speeds of 14 Gbps per pin since late May of this year. Essentially, the company confirmed that its scaling progress is going well, and HBM4E represents another milestone…

SK Hynix Unpacks Advanced Packaging Technologies, Including Intel EMIB, For Its Next-Gen HBM Memory As It Eyes 3D Structures For The Future

SK Hynix is leveraging advanced packaging technologies such as Intel's EMIB for its next-gen HBM solutions, which will eventually enter the 3D packaging stage. Scaling HBM Comes With Big Challenges & SK Hynix Is Leveraging Advanced Packaging Solutions To Address Them As It Ventures Into The 3D Era At Hot Chips 2026, Jaesik Lee (VP Package Engineering at SK Hynix) presented the "Advanced Packaging for High-Bandwidth Memory" brief, which talks abo…

Samsung Evolving HBM Base Die at Hot Chips 2026

At Hot Chips 2026, Samsung discussed how it plans to evolve the HBM base die to free up more package area for mroe efficient compute The post Samsung Evolving HBM Base Die at Hot Chips 2026 appeared first on ServeTheHome.