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SK Hynix Starts to Roll Out Next-Generation AI Server Memory

The module uses LPDDR5X chips and delivers more than twice the bandwidth of conventional RDIMMs, SK hynix said.

  • On Sunday, April 19, 2026, SK hynix Inc. announced mass production of the 192GB SOCAMM2, a next-generation memory module designed for the NVIDIA Vera Rubin AI platform.
  • This SOCAMM2 leverages low-power double data rate memory technology and uses a sixth-generation 10-nanometer class process, featuring a slim form factor for placement next to logic chips on system boards.
  • Compared to conventional Registered Dual In-Line Memory Modules , the module delivers more than double the bandwidth and over 75% improved power efficiency for high-performance AI operations.
  • SK hynix expects the product to resolve memory bottlenecks during training and inference of large language models with hundreds of billions of parameters, accelerating overall system processing speeds.
  • Meeting demand from global Cloud Service Providers , the company has stabilized mass production while collaborating with NVIDIA to optimize AI infrastructure performance as market focus shifts toward training.
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SK Hynix Begins Mass Production of SOCAMM2 Low-Power Server Memory SK Hynix has accelerated competition in the server memory market by commencing full-scale mass production of SOCAMM2, considered the next-generation AI server memory. On the 20th, SK Hynix [announced] 19... based on 10nm-class 6th generation 1c LPDDR5X low-power DRAM

(Seoul = Yonhap News) Reporter Cho Seong-heum = SK Hynix [is developing] SOCAMM, a next-generation memory module standard based on 10nm-class 6th generation (1c) LPDDR5X low-power DRAM...

·Korea (the Republic of)
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The Berkshire EagleThe Berkshire Eagle
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SK hynix Begins Mass Production of 192GB SOCAMM2 'Setting a New Standard for AI Server Memory Performance'

Mass production of 192GB high capacity products designed for the NVIDIA Vera Rubin platform

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PR Newswire broke the news in United States on Sunday, April 19, 2026.
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