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SECO launches new Genio 360- and Genio 360P-based SOMs and expands its Edge AI portfolio with MediaTek at Embedded World 2026

Summary by EEJournal
Arezzo, Italy – February 19, 2026– At Embedded World 2026 (March 10–12, Nuremberg), SECO will showcase a portfolio of MediaTek–based solutions, reinforcing its partnership and highlighting how their combined technologies enable advanced Edge AI across multiple verticals. SOM-Trizeps-X-Genio360/360P: cost-efficient Edge AI SOMs based on MediaTek Genio 360 and pin-to-pin compatible Genio 360P At Embedded World 2026, SECO will introduce SOM-Trizeps…
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EEJournal broke the news in on Thursday, February 19, 2026.
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