Samsung unveils HBM5 mock-up at Taiwan trade show
Samsung said HPB reduces thermal resistance and improves stability as it pushes next-generation memory chips for AI systems.
9 Articles
9 Articles
Samsung Electronics and SK Hynix engaged in a race for dominance over High Bandwidth Memory (HBM), which has emerged as a key component in the era of artificial intelligence (AI), at Computex 2026, Asia's largest IT and computing exhibition held in Taipei, Taiwan. Samsung Electronics emphasized its technological competitiveness by unveiling next-generation HBM5 (8th generation HBM) and new thermal management technology, while SK Hynix highlighte…
The company intends to significantly expand its chip production over the next five years, responding to the booming demand for AI semiconductors.
Samsung Electronics CTO Song Jae-hyuk: "HBM5 Provides Optimal Solution with HPB and 2nm Base Die" SK Hynix Introduces HBM4E and HBF Side-by-Side… Jensen Huang Tao Visits Booth SK Chairman Chey Tae-won: "Strong Partnership with TSMC… Hopes HBM Leadership Is Maintained" [Taipei (Taiwan) = Reporters Bae Tae-yong, Ko Seong-hyun] Samsung Electronics and SK Hynix participated side-by-side in 'Computex Taipei 2026,' Taiwan's largest computing exhibi…
Coverage Details
Bias Distribution
- 80% of the sources lean Right
Factuality
To view factuality data please Upgrade to Premium
