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Samsung Unveils HBM4E, Showcasing Comprehensive AI Solutions, NVIDIA Partnership and Vision at NVIDIA GTC 2026
Samsung introduced its sixth-generation HBM4 in mass production and debuted HBM4E, targeting AI data centers with speeds up to 16 gigabits per second per pin, at Nvidia GTC 2026.
- On Tuesday, Samsung Electronics unveiled its next-generation HBM4E chip at Nvidia GTC 2026 in San Jose, California, marking the first public display of the physical memory technology for advanced AI systems.
- Samsung is positioning itself as a total memory solution supplier for Nvidia's Vera Rubin AI platform, with both companies intending to lead a global transition in AI infrastructure.
- The physical HBM4E chip supports speeds of 16 gigabits per second per pin and bandwidth of 4.0 terabytes per second, utilizing Samsung's sixth-generation 10-nanometer-class DRAM process.
- Visitors can view Samsung's hybrid copper bonding technology, which stacks 16 or more layers while reducing heat resistance by more than 20 percent compared to conventional methods.
- Executive Vice President Song Yong-ho will present 'Transforming Semiconductor Manufacturing with Agentic AI from Design and Engineering to Production' on Tuesday, detailing Samsung's AI-driven manufacturing integration.
13 Articles
13 Articles
Nvidia GTC 2026: Samsung unveils HBM4E, showcasing comprehensive AI solutions, Nvidia partnership, and vision
Samsung Electronics outlined the full range of AI computing technologies it will present at Nvidia GTC 2026 in San Jose, California, March 16-19, highlighting memory, logic, foundry, and advanced packaging products aimed at supporting AI infrastructure, on-device intelligence, and manufacturing digitization.
Samsung and SK Hynix Participate in GTC 2026... Showcasing Memory Competitiveness. Samsung Electronics and SK Hynix participated side-by-side in NVIDIA's annual developer conference, GTC 2026, to showcase next-generation memory technologies. These include High Bandwidth Memory (HBM), server memory, and storage—key components that constitute AI infrastructure.
Read the original note in the following link: Samsung presents the HBM4E memory with new specifications in NVIDIA GTC 2026 Samsung presented in NVIDIA GTC 2026 its new HBM4E memory, designed for AI environments that require higher bandwidth and integration density. The announcement is also framed in a wider display of components for IA infrastructure developed for platforms linked to NVIDIA. NVIDIA selects Samsung and SK Hynix as providers of Ve…
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