Samsung Electronics ships HBM4E chip samples to global customers
The 48-gigabyte chip offers more than 20% faster speed and improved energy efficiency as Samsung targets AI server demand.
- On Friday, Samsung Electronics began shipping samples of its 12-layer HBM4E chip, describing the product as an industry-first high-bandwidth memory solution for AI customers globally.
- The new memory chip offers a 48-gigabyte capacity, a 30% increase over previous generations, and reaches speeds of up to 16 Gigabits-per-second with "improved energy efficiency and thermal performance."
- Samsung utilizes its latest 1c Dynamic Random-Access Memory process technology, integrating sixth-generation 10-nanometer-class DRAM with a 4-nanometer foundry logic base die.
- Major AI players including AMD, Nvidia, and Google are customers for these advanced memory chips, a rollout occurring three months after Samsung initiated HBM4 shipments in February.
- Samsung intends to expand the lineup to include 8-layer 32GB and 16-layer 64GB configurations, as executive vice president Sang Joon Hwang stated the company will "continue to drive the growth of the global AI memory market.
22 Articles
22 Articles
Samsung Electronics announced this Friday that it has begun to send samples of its latest high bandwidth memory chip (HBM4E) to its customers, thus anticipating its competitors in the distribution of a new version of this product, fundamental to the data centers of AI, which pushed up the value of its shares. South Korean technology company stated that the new chip, the 12-layer HBM4E, is more than 20% faster than its previous generation HBM4 pr…
Company stated that the 12-layer HBM4E chips represent an improvement of more than 20% in data processing speed and an increase of more than 30% in capacity compared to previous generation
Samsung Electronics unveiled the world's first samples of its cutting-edge 7th-generation 'HBM 4E' AI semiconductor today. Performance has been significantly improved just three months after the release of the 6th-generation product. Jensen Huang of NVIDIA, Samsung's largest customer, is scheduled to visit Korea next week,
Samsung begins shipment of HBM4E samples as AI memory competition intensifies
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
Channel News Asia
Samsung Electronics ships HBM4E chip samples to global customers
SEOUL, May 29 : Samsung Electronics said on Friday it has started shipping samples of its latest high-bandwidth memory (HBM) chip, or the 12-layer HBM4E, marking what it said was the industry's first shipment of such products. The South Korean tech company said the new chip represents a more than 20 per cent
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