Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push
The five-year memorandum covers HBM4 and HBM4E memory, two-nanometer foundry work and advanced packaging as AI chip demand accelerates.
- On Friday, Samsung Electronics and Broadcom signed a non-binding memorandum of understanding worth more than $200 billion for AI semiconductors, covering memory, foundry, and advanced packaging through 2030.
- Broadcom seeks supply chain resilience beyond its heavy reliance on TSMC, which controls more than 90 percent of leading-edge chip production; Samsung's foundry market share has fallen to roughly seven percent, creating mutual benefit.
- Samsung will supply Broadcom with next-generation HBM4 and HBM4E memory chips for AI accelerators and manufacture Broadcom products using two-nanometer process technologies at its Pyeongtaek campus in South Korea.
- The partnership was announced at an AI summit hosted by South Korean President Lee Jae Myung as part of a broader $950 billion package of semiconductor deals between South Korean and American companies.
- Samsung posted record quarterly operating profit of 89 trillion won in Q2, driven by AI memory demand, positioning the company to execute intensive R&D alongside Broadcom's custom AI chip designs for Google and Meta.
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Samsung's $200 Billion Broadcom Pact Tests Its AI Foundry Ambitions Against TSMC
Samsung Electronics and Broadcom just inked one of the largest semiconductor agreements on record. The memorandum of understanding, valued at more than $200 billion through 2030, spans memory chips, contract manufacturing and advanced packaging. Announced at an AI summit in San Francisco on July 24, it signals fresh momentum in the race to supply hardware for artificial intelligence systems. But an MOU carries no binding commitments on volume or…
Samsung Electronics wins $200 billion Broadcom AI chip partnership, boosting foundry push
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ReportWireSamsung nabs $200B chip deal with Broadcom
Samsung and Broadcom sign major agreement through 2030. Read more here.
Samsung, Broadcom Expand AI Semiconductor Partnership; Collaboration Estimated at over $200 Bn Through 2030
Get latest articles and stories on Business at LatestLY. Samsung Electronics and Broadcom on Saturday signed a memorandum of understanding (MoU) to expand their strategic collaboration across memory and foundry technologies, with the partnership expected to be worth more than USD 200 billion over the next five years through 2030. Business News | Samsung, Broadcom Expand AI Semiconductor Partnership; Collaboration Estimated at over $200 Bn Throug…
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