Samsung Electronics Launches Next-Generation AI Memory Technology

Samsung Electronics launches next-generation AI memory technology

Samsung Reveals New 3D-Memory Roadmap in Bid for AI Tech Lead

Samsung Electronics Co. offered a glimpse of its most advanced memory hardware, touting improved performance and power efficiency in a bid to overtake rivals SK Hynix Inc. and Micron Technology Inc. in the race for long-term dominance.

Samsung Unveils 400-Layer AI Memory With 58% Higher Density

Samsung Electronics introduced a new generation of artificial intelligence memory technology on Tuesday as it looks to strengthen its chipmaking position in the rapidly growing AI market. The world’s largest memory chip manufacturer presented its V10 Bonding V-NAND, also known as BV-NAND, prototype at this year’s Future of Memory and Storage conference in Santa Clara, California. The prototype features more than 400 layers and uses a new wafer-b…

Samsung Debuts Comprehensive 3D AI Memory Roadmap With zHBM, zNAND-O, And V10 BV-NAND

Samsung Electronics unveiled its next-generation AI memory portfolio at the Future of Memory and Storage (FMS) 2026 conference in Santa Clara, California, presenting a comprehensive technology roadmap designed to meet the fast growing demands of high-performance computing and artificial intelligence infrastructure.  The company showcased approximately 30 memory and storage technologies at an AI cloud server-inspired booth, while Jin-Yub Lee, Exe…

Samsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the ...