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Samsung Electro-Mechanics Advances Fcbga technology... "Mlc and Glass Substrates to Be Launched in 2027" [Vice President, Materials and Materials Division]
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[Digital Daily Reporter Go Seong-hyeon] "As semiconductor packaging technology advances, the demand for improved performance on substrates is also increasing. To meet this demand, we will reduce circuit line widths while enabling the application of various structures, such as multi-layer core (MLC) and glass substrates." Lee Seung-eun, Head of Product Planning, Package Marketing at Samsung Electro-Mechanics, made these remarks at the 'KPCA Show …
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