US EditionSamsung Electronics says customers praised competitiveness of HBM4 chip
Samsung highlights HBM4's market edge and plans AI integration in all products to meet rising global AI chip demand, leveraging its comprehensive chipmaking capabilities.
- On Jan 2, Jun Young‑hyun and Roh Tae‑moon issued New Year messages highlighting HBM4 competitiveness and a push to strengthen AI capacity, with Jun saying `On HBM4 in particular, customers have even stated that 'Samsung is back'`.
- Jun warned competition was intensifying rapidly and AI demand is now a given, saying unprecedented AI-chip demand requires bolder investment as 2026 will be tougher than last year, while Roh stressed integrating AI across products so the DX division can improve customer experiences.
- Quoting Jun, the company framed a one‑stop chip offering as a competitive advantage, saying `Samsung Electronics is the only chipmaker in the world that offers a one-stop solution encompassing logic chips, memory, foundry services and advanced packaging`, and noted the foundry business is 'primed for a great leap forward' after its $16.5 billion Tesla deal.
17 Articles
17 Articles
Samsung Electronics says customers praised competitiveness of HBM4 chip
Samsung Electronics customers have praised the differentiated competitiveness of its next-generation high-bandwidth memory (HBM) chips, or HBM4, saying "Samsung is back", co-CEO and chip chief Jun Young-hyun said in a New Year address.
Samsung co-CEOs vow to strengthen company's AI capacity in New Year's message
The co-chief executive officers of Samsung Electronics Co. on Friday vowed to lead the company in strengthening its artificial intelligence (AI) capacity amid intensifying global competition in the field. Samsung Electronics Vice Chairman and CEO Jun Young-hyun, who heads the company's key device solutions (DS) division that oversees its chip operations, highlighted the importance of responding to unprecedented demand for AI chips in the global …
After several quarters of self-discovery, Samsung is making a high-profile comeback. The company, a dominant player in the DRAM market for decades, initially visibly missed the boat on the transition to the HBM era. While AI accelerators demanded exploding memory bandwidths, Samsung struggled with yield problems, thermal weaknesses, and, above all, a lack of certifications from key partners like NVIDIA and AMD with HBM3. The result was a signifi…
"Samsung is Back in the HBM Race", Says Co-CEO, as the Korean Giant Is Poised to Reclaim Its Lost Dominance with HBM4
Samsung's HBM business is reportedly looking significantly stronger compared to where it was a few quarters ago, as the Korean giant's HBM4 is slated to be the most potent solution available. Samsung's HBM Market Share Is Projected to Surpass SK hynix By 2027, Driven by Recent Wins Samsung has been experiencing uncertainity with its DRAM business over the years, and despite being the dominant supplier among all other competitors for decades, the…
Jun Young-hyun, co-CEO and head of Samsung Electronics chips, highlighted that customers have praised the competitiveness of their HBM4 chip, including stating that “Samsung was back,” referring to the company’s undisputed leadership during the 1990s and 2000s. In a New Year’s speech addressed to employees, the manager reported having received positive customer feedback on his HBM4 chip (High Bandwidth Memory 4). This chip, intended for the next…
The South Korean electronics giant was negotiating memory chips with Nvidia in October and is racing to catch up with rivals, including fellow South Korean company SK Hynix, in AI chips.
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