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This New Japanese Consortium Wants to Develop a Novel Method for Making the Next Generation of Interposer Layers for Multi-Chiplet Mega-Processors
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Resonac, a major semiconductor materials manufacturer, has launched a new consortium of 27 semiconductor companies from Japan and overseas, aiming to lead research and development of next-generation semiconductors from the "back-end" of semiconductor manufacturing.
Resonac Launches 27-Member "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter "Resonac") today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level org…
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