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Rapidus and UKSC sign MoU on future chip manufacturing
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Rapidus signs MoU with UKSC
Rapidus, the Japanese initiative targetting 2nm process technology, has signed an MoU with the UK Semiconductor Centre (UKSC) covering future semiconductor manufacturing. In January 2026, the leaders of Japan and ... The post Rapidus signs MoU with UKSC appeared first on Electronics Weekly.
Rapidus and UKSC sign MoU on future chip manufacturing
Japanese chip manufacturer Rapidus has signed a Memorandum of Understanding (MoU) with the UK Semiconductor Centre (UKSC) to collaborate on future semiconductor manufacturing. The agreement was reached amid ongoing efforts to enhance technology ties between Japan and the UK. The UKSC promotes the…
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